Field Processing Engineer I

**Location:** Phoenix, Arizona, United States **Job ID:** R0138374 **Date Posted:** 2026\-07\-20 **Company Name:** HITACHI HIGH\-TECH AMERICA, INC. **Profession (Job Category):** Engineering \& Science **Job Schedule:** Full time **Remote:** No **Job Description:** POSITION TITLE: Field Process Engineer I DIV/DEPARTMENT NAME: Semiconductor Equipment Division (SED) REPORTS TO: Supervisor, Field Process Engineering POSITION STATUS: Full\-Time WORK LOCATION: Scottsdale, AZ (AZ2\) WORK STYLE DESIGNATION: Customer Hybrid (\+50% Onsite) WORK STYLE REQUIREMENT: Customer Onsite – 80% / HTA Office – 20% FLSA STATUS: Exempt TRAVEL REQUIRED: Up to 50% POSITIONS SUPERVISED: None EXPECTED SALARY RANGE: $66,756\.16 \- $91,789\.72 *This pay range is for the position's base salary only. This position may be eligible for other compensation including incentive pay and/or allowances. Candidates will receive additional information during the interview and selection process.* POSITION SUMMARY The Field Process Engineer I position is located in Scottsdale, Arizona and supports the business objectives of HTA’s Semiconductor Equipment Division (SED) at the customer site. This position will require the employee to be at the customer site \~80% of the time. The main objective of this position is to provide process engineering support to SED’s various customer activities and development programs associated with plasma etchers and Reactive Ion Etch (RIE) processes. Training will be given to develop specific skills and knowledge. The employee must be willing to travel to Asia for a training assignment if necessary. The engineer should be able to independently perform tasks, understand RIE theory, work in a cleanroom environment, and interface with customers on a detailed level. The engineer is also interfacing with engineers globally so strong interpersonal skills are required. PRIMARY RESPONSIBILITIES **{** E} Essential Functions {NE} Non\-Essential Functions * Day\-to\-Day responsibilities include completing assigned tasks in a timely fashion, developing good customer relations through calls, and emails, troubleshooting customer process issues, working closely with the customer to understand needs and reporting back to SED; as well as managing and driving projects to closure. {E} * Perform hands\-on RIE/dry etch process troubleshooting and development. This includes performing troubleshooting and demonstrations at the customer site, R\&D of new dry etch technology trends, and meeting the objectives of customer requirements for current and future technology processes. {E} * Utilize analytical tools and techniques to solve process implementation issues. {E} * Heavy use of data, analysis, design, and execution of experiments including DOE and working with code or developed code for the analysis of data. {E} * After training, must be able to operate Hitachi plasma etch systems and all associated semiconductor metrology equipment including